- 您现在的位置：买卖IC网 > Sheet目录1214 > EVAL-ADUMQSEBZ (Analog Devices Inc)EVAL BOARD FOR ICOUPLER SMD
Evaluation Board User Guide
EVALUATION BOARD HARDWARE
PAD LAYOUT FOR THE DUT
The evaluation board has a pad layout in U2 that accommo-
dates 16-lead, wide-body SOIC devices, as well as QSOP
miniature packages, as shown in Figure 2. Power and ground
connections connect to capacitor pads for Side 1 and Side 2.
Figure 2. DUT Pad Layout Component U2
Three low inductance, surface-mount bypass capacitors are
provided for each side. A 100 nF capacitor is installed on each
side in Capacitor C2 and Capacitor C3. Additional bypass
capacitors required for QSOP packages are below the QSOP
pads and within the pad layout of the SOIC package. They
cannot be installed if the SOIC is used.
In addition, there are 10 μF ceramic X7R capacitors, C1 on Side 1
and C4 on Side 2, that provide high frequency bypassing and
ripple reduction. For further ripple reduction in iso Power?
devices like the ADuM540x, tantalum capacitors are added to
C10 as a 68 μF value on Side 1 and to C5 as a 22 μF value on
Side 2. These large value ceramic and tantalum bypass capacitors
are not necessary for non- iso Power devices.
Many of the i Coupler devices have configuration pins that allow
outputs to be disabled or default levels to be set. These pins are
usually located at Pin 7 and Pin 10 in the wide-body package. Pull-
up 0 Ω resistors on SM Pad R4 and SM Pad R17 are provided to
pull these pins high. These pull-up resistors can be removed,
and pull-down resistors can be installed on R5 and R18.
In addition to the U2 DUT space, an additional pad layout is
provided at U1, specifically to accommodate an ADuM5000
iso Power device, as shown in Figure 3. This is a power supply
only device that can be used to provide secondary power for
any i Coupler in standalone mode or as a slave to boost power to
the ADuM520x or ADuM540x devices. The surface-mount
resistor pads that are used to control these functions are not
populated.
An ADuM5000 is not installed at Position U1; it is left to the
user to obtain and install this device if required. As shown in
Figure 3, the power and ground connections for this device are
different from the rest of the i Coupler components. The C6 to
C9 pad positions for bypass capacitors are provided but not
UG-042
Pull-up, pull-down, and connecting resistor pads are provided
(but not populated) to connect the ADuM5000 in master or slave
mode, as well as to set the output voltage. See the ADuM5000
data sheet for descriptions of the pin functions.
Figure 3. ADuM5000 Pad Layout Component U1
Grounding Scheme
The board consists of two separate ground and power systems.
Each side of the DUT can be operated from an independent
power and ground reference. This allows simulation of
conditions similar to the target application. The board provides
for board creepage and clearance typical of most 2.5 kV circuit
boards. It is not recommended for use above 2.5 kV rms transient
voltages or for isolation voltage testing above 2500 V rms.
EMI and EMC Measurements
The signal path has been made as simple as possible while still
providing flexibility. The board is not intended for detailed
characterization of system noise, EMI, or EMC. It may be useful
for initial bench work in these areas, but Analog Devices, Inc.,
does not guarantee that board results will be indicative of the
final system performance in these areas. The board includes
some of the structures discussed in the AN-0971 Application
Note for radiated EMI mitigation.
TERMINALS
Side 1 Power Supply Inputs
Power is supplied to the board via a set of terminal block
connectors labeled IO_1C, as shown in Figure 4. Power is
connected to the Pin 1 top terminal, and ground is connected to
the Pin 2 top terminal. Provisions for adding in-line inductors
for noise isolation have been made with the inclusion of Z1 and
Z2, which are 1206 size surface-mount components. These
positions are populated with 0 Ω resistors to connect power to
the board. If ferrite inductors are required for noise control,
these components should be removed and replaced with
appropriate inductors.
populated (0.1 μF X7R ceramic capacitors are recommended).
Rev. A | Page 3 of 8
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
EVAL-ADUSB2EBUZ
BOARD EVAL USBI
EVAL-ADV7195EB
BOARD EVAL FOR ADV7195
EVAL-ADV7401EBZ
BOARD EVALUATION FOR ADV7401
EVAL-ADV7403EBZ
BOARD EVALUATION FOR ADV7403
EVAL-ADV7510P-ABZ
BOARD EVAL FOR ADV7510
EVAL-ADV7800EB1Z
BOARD EVAL EXTERNAL DDR SD MEM
EVAL-ADV7802EB1Z
BOARD EVAL EXTERNAL DDR SD MEM
EVAL-ADV7840EB1Z
BOARD EVAL FOR ADV7840
相关代理商/技术参数
EVAL-ADUSB1EBZ
制造商:Analog Devices 功能描述:USB TO SPI/12C CONVERTER - Boxed Product (Development Kits)
EVAL-ADUSB2EBUZ
功能描述:BOARD EVAL USBI RoHS:是 类别:编程器，开发系统 >> 配件 系列:SigmaDSP® 产品培训模块:Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program RoHS指令信息:IButton RoHS Compliance Plan 标准包装:1 系列:- 附件类型:USB 至 1-Wire? RJ11 适配器 适用于相关产品:1-Wire? 设备 产品目录页面:1429 (CN2011-ZH PDF)
EVAL-ADUSB2EBZ
功能描述:BOARD EVAL USB TO SPI/12C RoHS:是 类别:编程器，开发系统 >> 配件 系列:SigmaDSP® 标准包装:1 系列:- 附件类型:适配器板 适用于相关产品:RCB230，RCB231，RCB212 配用:26790D-ND - RCB BREAKOUT BOARD RS232 CABLE
EVAL-ADV3014EBZ
功能描述:BOARD EVALUATION FOR ADV3014 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:- 标准包装:1 系列:PCI Express® (PCIe) 主要目的:接口，收发器，PCI Express 嵌入式:- 已用 IC / 零件:DS80PCI800 主要属性:- 次要属性:- 已供物品:板
EVAL-ADV7170EBM
制造商:AD 制造商全称:Analog Devices 功能描述:Digital PAL/NTSC Video Encoder
EVAL-ADV7171EBM
制造商:Analog Devices 功能描述:EVALUATION BOARD FOR DIGITAL PAL/NTSC VIDEO ENCODER WITH 10-BIT SSAF AND ADVANCED POWER MANAGEMENT
EVAL-ADV7173EBM
制造商:Analog Devices 功能描述:EVALUATION CONTROL BOARD I.C. - Bulk
EVAL-ADV7173EBZ
功能描述:BOARD EVALUATION FOR ADV7173 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:Advantiv® 标准包装:1 系列:- 主要目的:电信，线路接口单元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板，电源，线缆，CD 其它名称:82EBV2081